no code implementations • 7 Apr 2024 • Zhihui Deng, Yuanyuan Duan, Leilai Shao, Xiaolei Zhu
Chiplet-based systems, integrating various silicon dies manufactured at different integrated circuit technology nodes on a carrier interposer, have garnered significant attention in recent years due to their cost-effectiveness and competitive performance.
no code implementations • 28 Dec 2023 • Yuanyuan Duan, Xingchen Liu, Zhiping Yu, Hanming Wu, Leilai Shao, Xiaolei Zhu
When integrated with our fast thermal evaluation method, RLPlanner achieves an average improvement of 20. 28\% in minimizing the target objective (a combination of wirelength and temperature), within a similar running time, compared to the classic simulated annealing method with HotSpot.