Machine learning thermal circuit network model for thermal design optimization of electronic circuit board layout with transient heating chips

no code implementations • 28 Aug 2020 • Daiki Otaki, Hirofumi Nonaka, Noboru Yamada

This paper describes a method combining Bayesian optimization (BO) and a lamped-capacitance thermal circuit network model that is effective for speeding up the thermal design optimization of an electronic circuit board layout with transient heating chips.

Bayesian Optimization